BOARDCON EMBEDDED DESIGN
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核心板: CM3588SCompact3588S
4x Cortex-A76 + 4x Cortex-A55 85 x 56 mm 0° to + 70° C Android 14, Debian 12, Buildroot
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核心板: CM3576Compact3576
4x Cortex-A72 + 4x Cortex-A53 152.5 x 83 mm 0° to + 70° C Android, Debian
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Compact3566
Quad-core Cortex-A55 85 x 56 mm 0° to +70° C Android, Debian, Buildroot
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开发板: Idea1126B-PCM1126B-P
Quad-core Cortex-A53 35.0 x 34.0 mm -20° to + 85° C Debian, Buildroot
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开发板: EM1126B-PMINI1126B-P
Quad-core Cortex-A55 38 x 30 mm -20° to +85° C Debian, Buildroot
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开发板: EM3588MINI3588
4x Cortex-A76 + 4x Cortex-A55 62 x 48 mm 0° to + 80° C | -40° to +85° C Android, Debian, Buildroot
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开发板: ldea3588CM3588
4x Cortex-A76 + 4x Cortex-A55 67 x 53 mm 0° to + 80° C | -40° to +85° C Android, Debian, Buildroot
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开发板: Idea3588SCM3588S
4x Cortex-A76 + 4x Cortex-A55 57.5 x 45 mm 0° to +80° C Android, Debian, Buildroot
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开发板: Idea3576LGA3576
4x Cortex-A72 + 4x Cortex-A53 45 x 30 mm 0° to + 80° C | -40° to +85° C Debian, Buildroot
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开发板: SBC3576MINI3576
4x Cortex-A72 + 4x Cortex-A53 50 x 40 mm 0° to + 80° C | -40° to +85° C Android, Debian, Buildroot
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开发板: EM3576CM3576
4x Cortex-A72 + 4x Cortex-A53 57.5 x 44.0 mm 0° to + 80° C | -40° to +85° C Android, Debian, Buildroot, Yocto
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开发板: EM3568CM3568
Quad-core Cortex-A55 60 x 45 mm 0° to + 80° C | -40° to +85° C Android, Debian, Buildroot
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开发板: EM3566CM3566
Quad-core Cortex-A55 47 x 40 mm 0° to +80° C Android, Debian, Buildroot
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开发板: ldeaT527CMT527
Octa-core ARM Cortex-A55 56.0 x 42.5 mm 0° to + 70° C | -40° to +85° C Android, Linux
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开发板: EMT113CMT113
Dual-core Cortex-A7 36 x 30 mm -25° to +85° C Buildroot
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开发板: ldeaT41CMT41Z
Dual-core MIPS XBurst2 + RISC-V 31.7 x 25.5 mm -20° to +70° C Linux
